Optimised Reflow Settings
Zone 1
Zone 2
Zone 3
Zone 4
Zone 5
Zone 6
Zone 7
Zone 8
Zone 9
Zone 10
11.00
12 & 13
Max oven set temp
Distance between each zone
Card density Hi(1) low (2)
Oven zone settings
Weight of pannel/card in grams
Ramp rates in each zone
Board Tg Value
Dwell time in each zone (sec)
Total
Room Temperature
Time above LiqºC
Time >Liq
Conv speed (mm/sec)
Time above 230ºC
Time >230
Fan Speed
FR4 % damage by zone
Time above Liq (30-60 sec)
Target temperature on board
150.00
60.00
Time above 230ºC
Soak time (60-90 sec)
Liquidous temp of alloy
Based on Tg 150, % increase
If Tg 170 used % increase
=
100um outer layer % expansion
500um
inner layers % expansio
n
Time device is in damage
Area under curve (>300)
Engineer Name
Conveyor speed convertor
Convert cm/min to mm/sec
Cm/min
mm/sec
Card identification
Convert Inch/min to mm/sec
Inch/min
mm/sec
Program (i.e Nokia)
Reflow side 1
Reflow side 2
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